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SAC and other Pb-free solder alloys have a naturally grainy-looking solid structure as compared to that of Sn-Pb, so a dull solder joint is not necessarily indicative of a poor solder joint Tests such as tensile pullpeel, shock and vibration, thermal cycling, x-ray for solder void content, and metallographic cross-sectioning are much better means of assessing solder-joint quality There is yet another implication with the move to SAC solders If not quenched quickly, this alloy is known to result in some constituent separation Silver may precipitate out as platelets or needles This can be minimized by using a fast-cooling ramp Check with component manufacturer s specifications so as not to jeopardize component integrity 473.

Figure 85 clearly shows the classification of the microtechnology of optical, electrical and mechanical systems Microtechnology is a miniaturized combination of optics, electronics and mechanics Other than microelectromechanical systems (MEMS), there also exists a branch known as Micro Opto Electro Mechanical Systems (MOEMS) [2]

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7 Successful Oven Reflow Successful soldering is dependent on several factors including suitable, well-maintained, and controlled reflow equipment; good-quality solderable parts; a thermally balanced board designed for the reflow process; a well-tested and reliable solder paste; a proven time-temperature profile; and good thermometry techniques 47371 Adequately Maintained and Controlled Reflow Equipment The oven should have small thermal differentials across the width of the tunnel and should be capable of adequate heating and cooling ramps as well as adequate zone separation characteristics It should be stable for a given zone setting, not varying by more than a couple of degrees centigrade Similarly, the conveyor speed should be stable, not varying by more than 1 cm to 2 cm/min 47372 Good-Quality Solderable Parts The best reflow equipment, profiles, and solder paste will not make up for inadequacies in part quality or restore solderability.

Good solderable parts and boards are a must for successful reflow 47373 Coplanarity Coplanarity of component leads, BGA balls, or CCGA columns is a mustAll component leads should share a common seating plane within the specified tolerances associated with the component vendor s specification The coplanarity requirement also depends on the dispensed solder paste height and paste deposit uniformity, as the solder paste accommodates some small differences in lead-to-lead coplanarity both as a paste and also as the solder assumes the characteristic dome shape upon melting..

47374 Component Storage Extended storage should be avoided and parts should be kept cool and dry prior to use Sufficient quality control methods should be established to ensure that the solder and components are solderable Plastic molded parts such as plastic quad flat packs (PQFPs) and plastic ball grid arrays (PBGAs) can absorb moisture from the atmosphere over time When moisture-laden plastic packages are subjected to reflow soldering, the entrapped vapor may expand to the point where the package fractures, often damaging the silicon die and associated wires internal to the package This phenomenon is commonly known as popcorning throughout the industry Ensure that plastic packaged components are stored in unopened bags as supplied by the component vendor until time of use.

Once the components are removed from the manufacturer s packaging, follow IPC/JEDEC guidelines1 for useful shelf-life in the unbaked state and any bake-out requirements prior to soldering Parts must be suited for the temperature required by the reflow process Lastly, ensure that component contact or surface finish is compatible with the solder being used, be it leaded or lead-free 47375 Board Design for Oven Soldering Thermal balance of the board design is important for reliable and adequate reflow Ensure that a design for manufacturing (DFM) review of the board has been done and that thermally massive components are not relegated to one portion of the board Also, it is desirable to distribute smaller components rather than to create component fields to permit uniform thermal balance across the board Components should be spaced adequately to prevent shadowing of smaller devices on the board by larger, neighboring components.

This is particularly important in IR ovens without the forcedconvection option If the oven is characterized by poor uniformity across the tunnel width, the board should be oriented, if possible, to take advantage of the imbalance; ie, the board edge with greatest thermal mass should be aligned to the oven edge with the highest recorded process temperatures Board components should be designed far enough away from board edges to preclude any mechanical interference with the pin-chain conveyor Since the oven rails can have an influence on the reflow or damage of bottom-side components, leave enough edge clearance on the board to accommodate the pin-chain pin length plus some additional margin in case the board is moved from one reflow oven to another 47376 Paste and Profile.

6 dof Mo-Shapal Inertial Sensor, inside vacuum vessel, equipped with In-House Electronics mounted on 5 dof Micromanipulator

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