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One of the possible applications of the improved ADC is as a temperature recorder Figure 615 illustrates the circuit LM335 is a temperature sensor that provides a voltage output proportional to the ambient temperature The voltage generated by the sensor is 10 mV/K This temperature operates from 40 C to 100 C temperature So at room tem-.

The profile provided by the solder paste vendor is only a recommended starting point that needs to be optimized for the reflow conditions and process time requirements Solder paste with finer solder particles are more troublesome to flux owing to their greater total surface area and corresponding greater surface oxide volume per unit volume of solder It is important to limit exposure to high temperatures and particularly time above liquidus, as it is in this regime that the intermetallic layer growth is most vigorousThe thicker the intermetallic layer, the more brittle and less reliable the solder joint will be 4738 Impact of Pb-Free on Reflow Soldering Although the move to Pb-free soldering represents a major change for the industry, its impact on the reflow process and reflow equipment is minimal In many cases, reflow ovens used for Pb-bearing solders can be used for Pb-free reflow.

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There has been concern that Pb-containing dust collected on the tunnel walls, fans, and such could contaminate Pb-free solder, but it is unlikely that the small number of Pb-bearing particles in a properly vented oven will provide enough contamination to exceed the RoHS limit for Pb of 01 percent by weight As mentioned previously, to permit Pb-free reflow, reflow equipment may require some oven modifications There is little impact to the reflow process and most of the changes are material related Because many of the Pb-free solders are slower to wet out on leads and pads, extended wetting times may be required Many Pb-free solder pastes are more prone to solder void formation Extended soak (pre-heat) times and slightly higher peak temperatures are known to help with void reduction..

a. First RISC processor (1986) (8" 16" 14 layer-TH)

b. Same RISC processor as MCM-L (1991) (4" 4" 10 layer-TH/Bv seq. lam) c. Same RISC processor as HDI (1995) (2" 2" 2+2+2 HDI-microvia)

.

FIGURE 2.3 Example of the same computer CPU board as it used alternative component, assembly, and PWB technologies. (a) Size and appearance of each generation. (b) Movement of total board density from traditional to HDI. (c) HDI.

A 14-layer board through-hole with a surface area of 128 in2 in 1986 (Fig. 2.3[a]) to A 10-layer surface-mount technology board with a surface area of 16 in2 in 1991 (Fig. 2.3[b]) to A high-density interconnect board with sequential build-up microvias, buried and blind vias, and a surface area of 4 in2 in 1995 (Fig. 2.3[c])

Region of Advanced Technologies A second valuable feature of the chart in Fig. 2.2 is the area identified as the region of advanced technologies. This is where calculations and data have shown that it is necessary to have an HDI structure. Therefore, this is the barrier, or wall of HDI: on one side it is most cost effective to use traditional PWB technologies; on the other side it becomes cost effective to use HDI technologies. Continuing beyond this point, HDI becomes necessary.

Figure 6.14 Block diagram for an improved analog-to-digital converter using the on-chip comparator on an AVR processor.

To have the proper perspective on where PWBs fit into electronic systems, it will be helpful to describe briefly the packaging hierarchy of electronic systems. Some time ago, the Institute for Interconnecting and Packaging Electronic Circuits (IPC)2 proposed eight categories of

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