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3 McKeown, PA, High precision manufacturing in an advanced industrial economy, James Clayton Lecture, IMechE, 23rd April 1986 4 Fang, FZ and Venkatesh, VC, Diamond cutting of silicon with nanometric finish, Annals of the CIRP, 1998, Vol 47/1/, 45 49 5 Taniguchi, N, Current status in and future trends of ultra precision machining and ultra-fine processing, Annals of the CIRP, 1983, Vol 32, No 2, 573 582 6 Kalpakjian, S and Schmid, SR, Manufacturing Processes for Engineering Materials Prentice Hall, 1995 7 DeGarmo, EP, Black, JT and Kohsher, RA, Materials and Processes in Manufacturing, 6th ed, Macmillan Publishing Company, New York, 1964 8 Lindberg, RA, Processes and Materials of Manufacture, Allyn and Bacon Inc, USA, 1964 9 Konneh, M, An Experimental Investigation of Partial-Ductile Mode Grinding of Silicon PhD Thesis, Universiti Teknologi Malaysia, 2002 10 Mon, TT, Chemical-Mechanical Polishing of Optical Glass Subjected to Partial Ductile Grinding, Masters Thesis, Universiti Teknologi Malaysia, 2002 11 Izman, S, Machining of BK-7 Glass Subjected to Partial-Ductile Regime Grinding, PhD Thesis, Universiti Teknologi Malaysia, 2003 12 Venkatesh, VC, Precision manufacture of spherical and aspherical surfaces on plastics, glass, silicon and germanium, Current Science, Indian Academy of Sciences, 2003, Vol 84, No 9, 1211 1219 13 Venkatesh, VC and Tan, CP, The generation of aspheric surfaces on thermal imaging materials on a 4-axis CNC machining centre, Proceedings of ASPE Annual Meeting, Rochester, NY, 1990, 23 26 14 Horne, DF, Optical Reduction Technology Adam Hilger, Bristol, 2nd Ed, 1983 15 Kennedy, CW, Hoffman, EG and Bond, SD, Inspection and Gauging, 6th Ed, Industrial Press, USA, 1987 16 Venkatesh, VC, Inasaki, I, Toenshof, HK, Nakagawa, T and Marinescu, ID, Observations on polishing and ultra precision machining of semiconductor substrate materials, Annals of the CIRP, 1995, Vol 44/2/1995, 611 618 17 Bradley, IA, A History of Machine Tools, Model and Allied Publications Ltd, UK, 1972 18 Donaldson, RD, Patterson, S, Design and construction of a large vertical-axis diamond turning machine, SPIE s 27th Ann Int Tech Instrument Display, August 1983, 21 26 19 Bryan, JB, Design and construction of an ultra precision 84 inch diamond turning machine Precision Engineering, 1979, Vol 1, No 1, pp 13 17 20 Sagar, P, Temperature variations can crush accuracy, SME Magazine-Machine tool Basics, March 2001, 80 88 21 Cooling System Catalogue (in Japanese), BIG DAISHOWA, Vol 3, 148 22 Jackson, MJ, Microfabrication and Nanomanufacturing, Taylor and Francis, USA, 2006.

system elements in ascending order of size and complexity, which will be used here to illustrate typical electronic packaging structures These are as follows: Category A consists of fully processed active and passive devices Bare or uncased chips and discrete capacitors, resistors, or their networks are typical examples of this category Category B comprises all packaged devices (active and passive) in plastic packages, such as DIPs, TSOPs, QFPs, and BGAs, as well as those in ceramic packages, such as PGAs, and connectors, sockets, and switches All are ready to be connected to an interconnecting structure Category C is substrates that interconnect uncased or bare chips (ie, the components of category A) into a separable package Included here are all types of multichip modules (MCMs), chip-on-boards (COBs), and hybrids Category D covers all kinds of substrates that interconnect and form assemblies of already packaged components, ie.

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, those from categories B and C This category includes all types of rigid PWBs, flexible and rigid-flexible, and discrete-wiring boards Category E covers the back planes made by printed wiring and discrete-wiring methods or with flexible circuits, which interconnect PWBs, but not components, from the preceding groups Category F covers all intraenclosure connections Included in this category are harnesses, ground and power distribution buses, RF plumbing, and co-ax or fiberoptic wiring Category G includes the system assembly hardware, card racks, mechanical structures, and thermal control components Category H encompasses the entire integrated system with all its bays, racks, boxes, and enclosures and all auxiliary and support subsystems As seen from the preceding list, PWBs are exactly in the center of the hierarchy and are the most important and universally used element of electronic packaging.

The packaging categories F, G, and H are used mainly in large mainframes, supercomputers, central office switching, and some military systems Since there is a strong trend toward the use of miniaturized and portable electronic products for the majority of electronic packaging designs, trade-offs are made in the judicious application and selection among the elements of the first five categories These are discussed in this chapter..

Selection of the packaging approaches among the various aforementioned elements is dictated not only by the system function, but also by the component types selected and by the operating parameters of the system, such as the clock speeds, power consumption, and heat management methods, and the environment in which the system will operate. This section provides a brief overview of these basic constraints that must be considered for proper packaging design of the electronic system.

11 Explain with sketches the difference between accuracy and precision 12 (a) Discuss the achievable machining accuracy for normal, precision, high-precision and ultra-precision machining (b) Highlight some mechanical, electronic, and optical components, their tolerances and their machining aspects (c) Describe with sketches one component from each one of the above categories

Speed of Operation The speed at which the electronic system operates is a very important technical factor in the design of interconnections. Many digital systems operate at close to 100 MHz and are already reaching beyond that level. The increasing system speed is placing great demands on the ingenuity of packaging engineers and on the properties of materials used for PWB substrates.

(Temperature Sensor)

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